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| CAC1406-R45M | 0.45 | 0.9 | 100 | 32.5 | 54 | 18 | 25.5 | 6.5 |
| CAC1406-R50M | 0.5 | 0.9 | 110 | 21.3 | 38 | 18.5 | 27 | 6.5 |
| CAC1406-R55M | 0.55 | 1.3 | 90 | 20.8 | 35.5 | 16 | 22 | 5.5 |
| CAC1406-R80M | 0.8 | 1.2 | 89 | 27.5 | 47.5 | 17.5 | 24.5 | 6.5 |
| CAC1406-R90M | 0.9 | 1.7 | 76 | 17.8 | 28.5 | 14.5 | 20.5 | 6 |
| CAC1404-1R0M | 1 | 3.5 | 77 | 13.5 | 21 | 11.5 | 16.5 | 4 |
| CAC1405-1R0M | 1 | 1.7 | 73 | 16 | 27 | 13.9 | 16.5 | 5.2 |
| CAC1406-1R4M | 1.4 | 2.2 | 65 | 19 | 30 | 13.5 | 20 | 6.5 |
| CAC1404-1R5M | 1.5 | 4.4 | 50 | 13.5 | 21 | 10.5 | 14.5 | 4 |
| CAC1406-2R0M | 2 | 3.5 | 55 | 15 | 24 | 11.5 | 16.3 | 6.5 |
| CAC1404-2R2M | 2.2 | 5.9 | 46 | 9 | 15 | 7.5 | 10.5 | 4 |
| CAC1405-2R5M | 2.5 | 3.4 | 45 | 11 | 17.7 | 11.5 | 15.8 | 5.2 |
| CAC1406-2R8M | 2.8 | 4.1 | 43 | 13.7 | 22 | 10.5 | 15 | 6.5 |
| CAC1405-3R0M | 3 | 4.1 | 41 | 11 | 18 | 10.9 | 15.5 | 5.5 |
| CAC1404-3R3M | 3.3 | 8.8 | 40 | 7.5 | 12 | 6 | 9.9 | 4 |
| CAC1406-3R7M | 3.7 | 3.1 | 40 | 8 | 13.5 | 12 | 16.5 | 6.5 |
| CAC1405-4R5M | 4.5 | 7.1 | 34 | 7 | 11.8 | 8.5 | 11.7 | 5.2 |
| CAC1406-4R7M | 4.7 | 4 | 32 | 6.2 | 10.5 | 11 | 15.6 | 6.5 |
| CAC1406-6R0M | 6 | 5.5 | 26 | 5.6 | 9.5 | 9.2 | 13.5 | 6.5 |
| CAC1406-7R3M | 7.3 | 7.2 | 29 | 5 | 8.5 | 8.6 | 12 | 6.5 |
| CAC1406-9R2M | 9.2 | 9.7 | 26 | 4.6 | 7.8 | 7.2 | 10 | 6.5 |
| CAC1406-110M | 11.3 | 10.6 | 23 | 4 | 7 | 6.9 | 9.5 | 6.5 |
| CAC1406-130M | 13 | 12.6 | 21 | 4 | 6.7 | 6.1 | 8.5 | 6.5 |
| CAC1406-150M | 15.4 | 16.4 | 21 | 3.4 | 5.8 | 5.6 | 7.7 | 6.5 |
Notes:
1. All electrical specifications are referenced to 25°C ± 5°C ambient.
2. The inductance is measured at 100 kHz, 0.1 Vrms, 0 ADC.
3. The temperature of the component (ambient plus temperature rise) must be within the stated operating temperature range.
4. Isat, saturation current, means DC current at 25°C that causes an initial inductance drop of 10%/20% approx.
5. Irat, rated current, means DC current at 25°C that causes a temperature rise of 20°C/40°C approx.
Temperature rise is highly dependent on many factors including PCB land pattern, trace size, and proximity to other components.
Therefore temperature rise should be verified in application conditions.
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